HiSilicon

HiSilicon Kirin 8000

HiSilicon
Updated On: 12 Oct, 2026

HiSilicon Kirin 8000 is a Mid range mobile platform built on the 7 nanometers manufacturing process. Announced on October 2024, it packs 8 CPU cores and a powerful GPU.

Process Node
7 nanometers
CPU Cores
8
Max Bandwidth
51.2 Gb/s
GPU Clock
864 MHz
📶 5G: Yes 📡 4G LTE Supported 7 BT 6.0

Performance Overview

CPU Performance
32
Gaming Performance
11
Battery Efficiency
81

HiSilicon Kirin 8000 Specifications

Complete hardware architecture, GPU capabilities, memory standards, and connectivity tech specs.

Product Details
Model: HiSilicon Kirin 8000
Brand HiSilicon
Class Mid range
Released on: October 2024
Architecture & Process
Architecture1x 2.4 GHz – 1xA77 H3x 2.19 GHz – 1xA77 L4x 1.84 GHz – A55
Cores 8
Frequency 2400 MHz
Instruction Set ARMv8.2-A
Process 7 nanometers
Graphics
GPU Frequency864 MHz
Flops 442.3 Gigaflops
Memory
Memory Type LPDDR5
Memory BUS 4x 16 Bit
Memory Frequency 3200 MHz
Max Bandwidth51.2 Gb/s
Max Size12 GB
Storage Type UFS 2.2, UFS 3.1
Multimedia
Neural ProcessorYes
Video Capture 4K at 30FPS, 1K at 60FPS
Video Playback 4K at 30FPS, 1080p at 60FPS
Video Codecs - H.264 - H.265 - VP9
Audio Codecs - AAC - AIFF - CAF - MP3 - MP4 - WAV
Connectivity
5G Yes
Wi Fi 7
Bluetooth 6.0
Navigation GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Data sourced from official manufacturer parameters and trusted hardware directories. Human verification errors can happen—please report inaccuracies via our contact page.

HiSilicon Kirin 8000 Benchmark Scores

Standard synthetic performance benchmark evaluations.

Geekbench

Geekbench Score

Single-Core Score909
Multi-Core Score2399